Invention Grant
- Patent Title: Electronic packages for flip chip devices
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Application No.: US14968688Application Date: 2015-12-14
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Publication No.: US09613891B2Publication Date: 2017-04-04
- Inventor: Daniel M. Kinzer
- Applicant: NAVITAS SEMICONDUCTOR INC.
- Applicant Address: US CA El Segundo
- Assignee: Navitas Semiconductor, Inc.
- Current Assignee: Navitas Semiconductor, Inc.
- Current Assignee Address: US CA El Segundo
- Agency: Kilpatrick Townsend and Stockton, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/31 ; H01L21/56
Abstract:
Electronic packages are formed from a generally planar leadframe having a plurality of leads coupled to a GaN-based semiconductor device, and are encased in an encapsulant. The plurality of leads are interdigitated and are at different voltage potentials.
Public/Granted literature
- US20160247748A1 ELECTRONIC PACKAGES FOR FLIP CHIP DEVICES Public/Granted day:2016-08-25
Information query
IPC分类:
