An electronic device includes a semiconductor memory. The semiconductor memory includes a plurality of planes vertically stacked over a substrate. Each plane includes one or more cell mats. Each cell mat includes lower lines, upper lines crossing the lower lines, and variable resistance elements positioned in intersection regions of the lower lines and the upper lines, respectively. Lower contacts are coupled to the lower lines, respectively, and, in a plan view, overlap with a boundary region between half of the upper lines and the other half number of the upper lines. Upper contacts are coupled to the upper lines, respectively, and overlap with a boundary region between a half number of the lower lines and the other half number of the lower lines. One cell mat of an upper plane is vertically stacked over a lower plane to overlap with two adjacent cell mats of the lower plane.