Invention Grant
- Patent Title: Structure to prevent solder extrusion
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Application No.: US14057649Application Date: 2013-10-18
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Publication No.: US09613921B2Publication Date: 2017-04-04
- Inventor: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent David Cain; Andrew M. Calderon
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A spacer structure formed adjacent a solder connection which prevents solder extrusion and methods of manufacture are disclosed. The method includes forming a solder preform connection on a bond pad of a chip. The method further includes forming a spacer structure on sidewalls of the solder preform connection. The method further includes subjecting the solder preform connection to a predetermined temperature to form a solder connection with the spacer structure remaining thereabout.
Public/Granted literature
- US20150108642A1 STRUCTURE TO PREVENT SOLDER EXTRUSION Public/Granted day:2015-04-23
Information query
IPC分类:
