Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US14750897Application Date: 2015-06-25
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Publication No.: US09613927B2Publication Date: 2017-04-04
- Inventor: Akihiro Kimura , Takeshi Sunaga , Shouji Yasunaga , Akihiro Koga
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Howison & Arnott, LLP
- Priority: JP2011-082405 20110404; JP2011-082560 20110404; JP2011-104349 20110509; JP2011-105511 20110510; JP2011-105512 20110510; JP2011-105513 20110510
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/433 ; H01L23/495 ; H01L21/56 ; H01L21/48 ; H01L23/36 ; H01L23/367 ; H01L25/065 ; H01L25/00
Abstract:
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
Public/Granted literature
- US20150294952A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-10-15
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