Invention Grant
- Patent Title: Module and method for manufacturing the module
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Application No.: US14987892Application Date: 2016-01-05
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Publication No.: US09613938B2Publication Date: 2017-04-04
- Inventor: Soichiro Suzu , Tomohito Taki
- Applicant: Soichiro Suzu , Tomohito Taki
- Applicant Address: JP Tokyo
- Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2015-014359 20150128
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L25/10 ; H01L23/043 ; H01L21/54 ; H01L23/00 ; H01L25/00 ; H01L23/16

Abstract:
A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess.
Public/Granted literature
- US20160219707A1 MODULE AND METHOD FOR MANUFACTURING THE MODULE Public/Granted day:2016-07-28
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