Invention Grant
- Patent Title: Interposer for a package-on-package structure
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Application No.: US14733201Application Date: 2015-06-08
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Publication No.: US09613942B2Publication Date: 2017-04-04
- Inventor: Jae Sik Lee , Kyu-Pyung Hwang , Hong Bok We
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/498 ; H01L25/065 ; H01L23/50 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L21/48 ; H01L23/14 ; H01L23/00 ; H01L25/10
Abstract:
A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the second die. The interposer includes copper-filled vias formed within a mold.
Public/Granted literature
- US20160358899A1 INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE Public/Granted day:2016-12-08
Information query
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