Invention Grant
- Patent Title: Manufacture method of TFT substrate and sturcture thereof
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Application No.: US14427633Application Date: 2014-09-11
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Publication No.: US09614036B2Publication Date: 2017-04-04
- Inventor: Jun Wang
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410415838 20140820
- International Application: PCT/CN2014/086259 WO 20140911
- International Announcement: WO2016/026178 WO 20160225
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/786 ; H01L29/24 ; H01L29/66

Abstract:
The present invention provides a manufacture method of an oxide semiconductor TFT substrate, and the method comprises steps of: 1, forming a gate (2) on a substrate (1); 2, deposing a gate isolation layer (3); 3, forming an island shaped oxide semiconductor layer (4); 4, forming an island shaped photoresistor layer (6) and an island shaped etching stopper layer (5), and the island shaped etching stopper layer (5) covers a central part (41) of the island shaped oxide semiconductor layer (4) and exposes two side parts (43) of the island shaped oxide semiconductor layer (4); 5, implementing ion implantation process to the two side parts (43) of the island shaped oxide semiconductor layer (4); 6, lifting off the island shaped photoresistor layer (6); 7, forming a source/a drain (7), and the source/the drain (7) contact the two side parts (43) of the island shaped oxide semiconductor layer (4) to establish electrical connections; 8, deposing and patterning a protecting layer (8); 9, deposing and patterning a pixel electrode layer (9); 10, implementing anneal process.
Public/Granted literature
- US20160056267A1 MANUFACTURE METHOD OF TFT SUBSTRATE AND STURCTURE THEREOF Public/Granted day:2016-02-25
Information query
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