Invention Grant
- Patent Title: Semiconductor device with current sensor
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Application No.: US14853164Application Date: 2015-09-14
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Publication No.: US09614044B2Publication Date: 2017-04-04
- Inventor: Michael Hutzler , Maximilian Roesch
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014113254 20140915
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L29/739 ; H01L29/66 ; H01L29/40 ; H01L29/78 ; H01L29/06 ; H01L27/088

Abstract:
A semiconductor device includes a semiconductor body. The semiconductor body includes a load transistor part and a sensor transistor part. A first source region of the load transistor part and a second source region of the sensor transistor part are electrically separated from each other. A common gate electrode in a common gate trench extends into the semiconductor body from a first surface. A first part of the common gate trench is in the load transistor part, and a second part of the common gate trench is in the sensor transistor part. A field electrode in a field electrode trench extends into the semiconductor body from the first surface. A maximum dimension of the field electrode trench parallel to the first surface is smaller than a depth of the field electrode trench.
Public/Granted literature
- US20160079377A1 Semiconductor Device with Current Sensor Public/Granted day:2016-03-17
Information query
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