Invention Grant
- Patent Title: Method of processing a semiconductor device and chip package
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Application No.: US14488334Application Date: 2014-09-17
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Publication No.: US09614045B2Publication Date: 2017-04-04
- Inventor: Srinivasa Reddy Yeduru , Joachim Hirschler , Harald Wiedenhofer , Franz Kleinbichler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L21/02 ; H01L21/3105
Abstract:
In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
Public/Granted literature
- US20160079087A1 METHOD OF PROCESSING A SEMICONDUCTOR DEVICE AND CHIP PACKAGE Public/Granted day:2016-03-17
Information query
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