Invention Grant
- Patent Title: Semiconductor device and method for manufacturing thereof
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Application No.: US14680141Application Date: 2015-04-07
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Publication No.: US09614062B2Publication Date: 2017-04-04
- Inventor: Shunpei Yamazaki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2012-014049 20120126
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/78 ; H01L27/12 ; H01L21/426

Abstract:
In a semiconductor device including a transistor using an oxide semiconductor film, stable electric characteristics can be provided and high reliability can be achieved. A structure of the semiconductor device, which achieves high-speed response and high-speed operation, is provided. In a semiconductor device including a transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer are stacked in order and a sidewall insulating layer is provided on the side surface of the gate electrode layer, the sidewall insulating layer has an oxygen-excess regions, which is formed in such a manner that a first insulating film is formed and then is subjected to oxygen doping treatment, a second insulating is formed over the first insulating film, and a stacked layer of the first insulating film and the second insulating film are etched.
Public/Granted literature
- US20150214342A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2015-07-30
Information query
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