Invention Grant
- Patent Title: Semiconductor device provided with an IE type trench IGBT
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Application No.: US15138687Application Date: 2016-04-26
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Publication No.: US09614066B2Publication Date: 2017-04-04
- Inventor: Hitoshi Matsuura
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2014-105788 20140522; JP2015-36141 20150226
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/739 ; H01L29/423 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/36 ; H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/40

Abstract:
A switching loss is prevented from being deteriorated by suppressing increase in a gate capacitance due to a cell shrink of an IE type trench gate IGBT. A cell formation region is configured of a linear active cell region, a linear hole collector cell region, and a linear inactive cell region between them. Then, upper surfaces of the third and fourth linear trench gate electrodes which are formed so as to sandwich both sides of the linear hole collector cell region and electrically connected to an emitter electrode are positioned to be lower than upper surfaces of the first and second linear trench gate electrodes which are formed so as to sandwich both sides of the linear active cell region and electrically connected to a gate electrode.
Public/Granted literature
- US20160240643A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-08-18
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