Invention Grant
- Patent Title: Semiconductor structure having enlarged regrowth regions and manufacturing method of the same
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Application No.: US15250014Application Date: 2016-08-29
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Publication No.: US09614085B2Publication Date: 2017-04-04
- Inventor: Chin-I Liao , Shih-Chieh Chang , Hsiu-Ting Chen , Shih-Hsien Cheng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L29/16 ; H01L29/08 ; H01L29/06 ; H01L29/66

Abstract:
The present disclosure provides a semiconductor structure, including: an insulation region including a top surface; a semiconductor fin protruding from the top surface of the insulation region; a gate over the semiconductor fin; and a regrowth region partially positioned in the semiconductor fin, and the regrowth region forming a source/drain region of the semiconductor structure; wherein a profile of the regrowth region taken along a plane perpendicular to a direction of the semiconductor fin and top surfaces of the insulation region includes a girdle, an upper girdle facet facing away from the insulation region, and a lower girdle facet facing toward the insulation region, and an angle between the upper girdle facet and the girdle is greater than about 54.7 degrees.
Public/Granted literature
- US20160365448A1 SEMICONDUCTOR STRUCTURE HAVING ENLARGED REGROWTH REGIONS AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2016-12-15
Information query
IPC分类: