Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15002002Application Date: 2016-01-20
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Publication No.: US09614103B2Publication Date: 2017-04-04
- Inventor: Kensuke Ota , Toshifumi Irisawa , Masumi Saitoh , Kiwamu Sakuma
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-010050 20150122
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L21/306 ; H01L21/324 ; H01L29/49 ; H01L29/66 ; H01L21/3213

Abstract:
A semiconductor device according to an embodiment includes a first region including an oxide semiconductor containing indium (In), gallium (Ga), and zinc (Zn), a second region and a third region between which the first region is disposed, at least one of the second region and the third region having a higher indium (In) concentration than the first region and containing at least one metal element from the group consisting of titanium (Ti), tungsten (W), copper (Cu), zinc (Zn), aluminum (Al), lead (Pb), and tin (Sn), an electrode; and an insulating layer disposed between the first region and the electrode.
Public/Granted literature
- US20160218224A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-07-28
Information query
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