Invention Grant
- Patent Title: OLED package method and OLED package structure
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Application No.: US14426986Application Date: 2014-09-19
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Publication No.: US09614177B2Publication Date: 2017-04-04
- Inventor: Jiajia Qian , Yawei Liu , Chihche Liu , Taipi Wu
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410436753 20140829
- International Application: PCT/CN2014/086883 WO 20140919
- International Announcement: WO2016/029523 WO 20160303
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L27/32 ; H01L51/00

Abstract:
The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).
Public/Granted literature
- US20160248042A1 OLED PACKAGE METHOD AND OLED PACKAGE STRUCTURE Public/Granted day:2016-08-25
Information query
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