In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10−7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.