Invention Grant
- Patent Title: Composite module and electronic apparatus including the same
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Application No.: US14010790Application Date: 2013-08-27
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Publication No.: US09614271B2Publication Date: 2017-04-04
- Inventor: Morihiro Nakano , Yuichi Ito , Taro Hirai , Hidetaka Kuwahara
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-217180 20120928
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H05K7/00 ; H05K9/00 ; H01Q1/24 ; H01Q1/52
Abstract:
A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.
Public/Granted literature
- US20140091983A1 COMPOSITE MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME Public/Granted day:2014-04-03
Information query
