Invention Grant
- Patent Title: Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
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Application No.: US14918648Application Date: 2015-10-21
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Publication No.: US09614295B2Publication Date: 2017-04-04
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2010-287782 20101224; JP2011-159922 20110721
- Main IPC: B23K101/36
- IPC: B23K101/36 ; H01R4/02 ; B23K35/02 ; B23K35/26 ; C22C9/05 ; C22C9/06 ; C22C13/00 ; C22C13/02 ; H05K3/34 ; B23K1/00 ; H01R4/58
Abstract:
A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.
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