Invention Grant
- Patent Title: Integrated circuit chip cooling device
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Application No.: US14487758Application Date: 2014-09-16
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Publication No.: US09615443B2Publication Date: 2017-04-04
- Inventor: Stephane Monfray , Sandrine Lhostis , Christophe Maitre , Olga Kokshagina , Philippe Coronel
- Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA , Commissariat A L'Energie Atomique et aux Energies Alternatives
- Applicant Address: FR Crolles FR Montrouge FR Paris
- Assignee: STMicroelectronics (Crolles 2) SAS,STMicroelectronics SA,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee: STMicroelectronics (Crolles 2) SAS,STMicroelectronics SA,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Crolles FR Montrouge FR Paris
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1358934 20130917
- Main IPC: F28F27/00
- IPC: F28F27/00 ; H05K1/02 ; F28D9/00 ; F28F27/02 ; H01L23/473
Abstract:
An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.
Public/Granted literature
- US20150075749A1 INTEGRATED CIRCUIT CHIP COOLING DEVICE Public/Granted day:2015-03-19
Information query
