Invention Grant
- Patent Title: Copper particulate dispersion, conductive film forming method and circuit board
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Application No.: US14346519Application Date: 2012-01-04
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Publication No.: US09615455B2Publication Date: 2017-04-04
- Inventor: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
- Applicant: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
- Applicant Address: JP Hyogo US TX Austin
- Assignee: ISHIHARA CHEMICAL CO., LTD.,APPLIED NANOTECH HOLDINGS, INC.
- Current Assignee: ISHIHARA CHEMICAL CO., LTD.,APPLIED NANOTECH HOLDINGS, INC.
- Current Assignee Address: JP Hyogo US TX Austin
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-248126 20111114
- International Application: PCT/JP2012/050009 WO 20120104
- International Announcement: WO2013/073199 WO 20130523
- Main IPC: H05K3/00
- IPC: H05K3/00 ; C09D11/52 ; H01B1/22 ; H05K1/09 ; H01B1/02 ; H01L23/498 ; H05K3/12

Abstract:
The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
Public/Granted literature
- US20140370310A1 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND CIRCUIT BOARD Public/Granted day:2014-12-18
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