- Patent Title: Method of mounting semiconductor element, and semiconductor device
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Application No.: US14073998Application Date: 2013-11-07
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Publication No.: US09615464B2Publication Date: 2017-04-04
- Inventor: Takashi Kubota , Masayuki Kitajima , Takatoyo Yamakami , Hidehiko Kira
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2013-058764 20130321
- Main IPC: H05K3/34
- IPC: H05K3/34 ; B23K35/02 ; B23K3/08 ; H01L23/00 ; H01L31/167 ; H01S5/022
Abstract:
A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.
Public/Granted literature
- US20140285989A1 METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE Public/Granted day:2014-09-25
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