- Patent Title: Light emitting device, and method for manufacturing circuit board
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Application No.: US14478086Application Date: 2014-09-05
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Publication No.: US09615493B2Publication Date: 2017-04-04
- Inventor: Ryohei Yamashita , Tomohide Miki , Hiroto Tamaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2010-253321 20101111
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/48 ; H05K13/00 ; H01L23/00
Abstract:
A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.
Public/Granted literature
- US20140366369A1 LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD Public/Granted day:2014-12-18
Information query
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