Invention Grant
- Patent Title: Method for direct metallization of non-conductive substrates
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Application No.: US13636087Application Date: 2011-03-21
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Publication No.: US09617644B2Publication Date: 2017-04-11
- Inventor: Andreas Königshofen , Danica Elbick , Markus Dahlhaus
- Applicant: Andreas Königshofen , Danica Elbick , Markus Dahlhaus
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: DE102010012204 20100319
- International Application: PCT/US2011/029194 WO 20110321
- International Announcement: WO2011/116376 WO 20110922
- Main IPC: C23C18/54
- IPC: C23C18/54 ; C23C18/28 ; C23C18/30 ; C23C18/40 ; C23C18/16 ; C23C18/20 ; C23C18/34 ; C23C18/36 ; C23C18/44 ; C23C18/52 ; C25D11/00
Abstract:
The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
Public/Granted literature
- US20130316082A1 METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES Public/Granted day:2013-11-28
Information query
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