Invention Grant
- Patent Title: Gas sensor package
-
Application No.: US14503480Application Date: 2014-10-01
-
Publication No.: US09618490B2Publication Date: 2017-04-11
- Inventor: Jee Heum Paik , Yun Mi Bae , Go Eun Hwang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2013-0117299 20131001; KR10-2013-0126035 20131022
- Main IPC: G01N33/00
- IPC: G01N33/00 ; G01N27/12 ; H01C7/04 ; B81B7/00 ; H01L23/00
Abstract:
Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.
Public/Granted literature
- US20150090002A1 GAS SENSOR PACKAGE Public/Granted day:2015-04-02
Information query
