Invention Grant
- Patent Title: Selectively recessed reference plane structure in module tab area of memory module and method for forming selectively recessed reference plane
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Application No.: US14625837Application Date: 2015-02-19
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Publication No.: US09618983B2Publication Date: 2017-04-11
- Inventor: Dongyeop Kim , Jaejun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse P.C.
- Priority: KR10-2014-0022140 20140225
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/18
Abstract:
A memory module includes a signal tab and a power tab spaced apart from each other on a surface layer of a substrate, the signal tab and the power tab defining a module tab area, a reference plane layer below the surface layer, the reference plane layer being recessed below the signal tab and being non-recessed below the power tab, and an insulating layer between the surface layer and the reference plane layer.
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