Invention Grant
- Patent Title: Board, board apparatus and method for interconnection of boards
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Application No.: US14891408Application Date: 2014-05-14
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Publication No.: US09619000B2Publication Date: 2017-04-11
- Inventor: Noriyuki Itabashi , Shingo Takahashi
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-105356 20130517
- International Application: PCT/JP2014/062870 WO 20140514
- International Announcement: WO2014/185462 WO 20141120
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F1/32 ; G06F13/40 ; H04L9/30 ; H01L23/538 ; H04L29/06 ; H05K1/02 ; H05K1/14

Abstract:
Disclosed is a board including a semiconductor device including a first terminal to receive a signal that sets a functionality of the device, a second terminal to supply a first value and a third terminal to supply a second value, a first connection member connected to the first to third terminals of the semiconductor device, and a second connection member adapted to be connected to the first connection member provided on a counterpart board, with at least two terminals of the second connection member connected together via a first connection circuit, wherein the first connection member of the board is connected to the second connection member of another counterpart board.
Public/Granted literature
- US20160282923A1 BOARD, BOARD APPARATUS AND METHOD FOR INTERCONNECTION OF BOARDS Public/Granted day:2016-09-29
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