Invention Grant
- Patent Title: Capacitive sensor integrated in an integrated circuit package
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Application No.: US14247618Application Date: 2014-04-08
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Publication No.: US09619675B2Publication Date: 2017-04-11
- Inventor: Jared G. Bytheway , Steven C. Peterson
- Applicant: CIRQUE CORPORATION
- Applicant Address: US UT Salt Lake City
- Assignee: CIRQUE CORPORATION
- Current Assignee: CIRQUE CORPORATION
- Current Assignee Address: US UT Salt Lake City
- Agency: Morriss O'Bryant Compagni, PC
- Main IPC: G06F21/60
- IPC: G06F21/60 ; G06F21/86 ; G06F21/55
Abstract:
A system and method for disposing a capacitive proximity and touch sensor in locations where an integrated circuit package may be vulnerable to intrusion by providing electrodes in the packaging that may prevent interception of data obtained by a probe that is brought into proximity of the integrated circuit.
Public/Granted literature
- US20140304826A1 CAPACITIVE SENSOR INTEGRATED IN AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2014-10-09
Information query
