Invention Grant
- Patent Title: Sealed header assembly
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Application No.: US14966500Application Date: 2015-12-11
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Publication No.: US09620265B2Publication Date: 2017-04-11
- Inventor: Kevin John Peterson , Kenneth Wade Long, Jr. , William John Remaley
- Applicant: TYCO ELECTRONICS CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H01B17/30
- IPC: H01B17/30 ; B60R16/02 ; H02G3/08 ; H05K5/06 ; H05K5/02 ; H02G15/013

Abstract:
A sealed header assembly includes a housing having a cover shroud portion, a mounting portion, and a wire holder portion. The sealed header assembly includes a wire cover removably mounted to the housing. A seal is held within the housing by a seal cap. The housing and wire cover include wire guidance features for providing a path for the wire to exit the housing.
Public/Granted literature
- US20160211057A1 SEALED HEADER ASSEMBLY Public/Granted day:2016-07-21
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