Invention Grant
- Patent Title: Electronic component with a leadframe
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Application No.: US14880072Application Date: 2015-10-09
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Publication No.: US09620391B2Publication Date: 2017-04-11
- Inventor: Wolfgang Hauser , Viktor Heitzler , Christian Joos
- Applicant: Micronas GmbH
- Applicant Address: DE Freiburg
- Assignee: Micronas GmbH
- Current Assignee: Micronas GmbH
- Current Assignee Address: DE Freiburg
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: DE10247610 20021011
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/495 ; H01L23/00
Abstract:
The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.
Public/Granted literature
- US20160035594A1 ELECTRONIC COMPONENT WITH A LEADFRAME Public/Granted day:2016-02-04
Information query
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