Invention Grant
- Patent Title: Semiconductor device, related manufacturing method, and related electronic device
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Application No.: US15098855Application Date: 2016-04-14
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Publication No.: US09620427B2Publication Date: 2017-04-11
- Inventor: Chao Zheng , Junde Ma , Liangliang Guo , Wei Wang
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201410370715 20140730
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/26 ; H01L23/522 ; B81B7/00 ; H01L49/02
Abstract:
A semiconductor device may include an enclosure structure. The semiconductor device may further include a getter for absorb gas molecules. The getter may be positioned (and enclosed) inside the enclosure structure and may overlap a first portion of a surface of the enclosure structure. The semiconductor device may further include an inductor. The inductor may be positioned (and enclosed) inside the enclosure structure and may overlap a second portion of the surface of the enclosure structure without overlapping the getter in a direction perpendicular to the first surface of the enclosure structure.
Public/Granted literature
- US20160233138A1 SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE Public/Granted day:2016-08-11
Information query
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