Invention Grant
- Patent Title: Sawing underfill in packaging processes
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Application No.: US13356173Application Date: 2012-01-23
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Publication No.: US09620430B2Publication Date: 2017-04-11
- Inventor: Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
- Applicant: Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L25/065 ; H01L27/06
Abstract:
A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.
Public/Granted literature
- US20130187258A1 Sawing Underfill in Packaging Processes Public/Granted day:2013-07-25
Information query
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