Invention Grant
- Patent Title: Chip package including recess in side edge
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Application No.: US14619658Application Date: 2015-02-11
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Publication No.: US09620431B2Publication Date: 2017-04-11
- Inventor: Chia-Ming Cheng , Tsang-Yu Liu , Chi-Chang Liao , Yu-Lung Huang
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103104366A 20140211; TW104104197A 20150209
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L23/31
Abstract:
A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. A method for forming the chip package is also provided.
Public/Granted literature
- US20150228557A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2015-08-13
Information query
IPC分类:
