Invention Grant
- Patent Title: Evaporator, cooling device, and electronic device
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Application No.: US14697822Application Date: 2015-04-28
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Publication No.: US09620435B2Publication Date: 2017-04-11
- Inventor: Atsushi Endo , Osamu Aizawa , Hideo Kubo
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2014-103456 20140519
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H05K7/20 ; F28D15/02

Abstract:
An evaporator includes a housing in which an evaporator chamber configured to evaporate a refrigerant is formed; a heat transfer surface provided on an inner wall of the housing and having a hot area which is a part that becomes hot due to heat transferred from a heating element to the housing; and a supply port formed in the housing, opposed to the hot area and configured to eject the refrigerant supplied from a supply pipe to the hot area, wherein a narrow groove is formed in the heat transfer surface.
Public/Granted literature
- US20150334876A1 EVAPORATOR, COOLING DEVICE, AND ELECTRONIC DEVICE Public/Granted day:2015-11-19
Information query
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