Invention Grant
- Patent Title: Wiring board, electronic component device, and method for manufacturing those
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Application No.: US14962527Application Date: 2015-12-08
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Publication No.: US09620446B2Publication Date: 2017-04-11
- Inventor: Noriyoshi Shimizu , Hiromu Arisaka , Akio Rokugawa , Toshinori Koyama
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-Shi
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-Shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2014-250019 20141210; JP2015-019885 20150204
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H01L23/498 ; H01L23/31 ; H05K1/11 ; H05K1/18 ; H01L23/544 ; H01L23/00

Abstract:
A wiring board includes plural terminals, an insulating layer, and recess portions. Each terminal includes a roughened upper surface and a roughened side surface. The insulating layer is formed between the terminals. The upper surfaces of the terminals are exposed. An upper surface of the insulating layer is a concave curved surface. The recess portions are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals.
Public/Granted literature
- US20160174379A1 WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING THOSE Public/Granted day:2016-06-16
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