Invention Grant
- Patent Title: Integrated circuits on a wafer and methods for manufacturing integrated circuits
-
Application No.: US12668419Application Date: 2008-07-10
-
Publication No.: US09620456B2Publication Date: 2017-04-11
- Inventor: Heimo Scheucher
- Applicant: Heimo Scheucher
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP07112371 20070712
- International Application: PCT/IB2008/052778 WO 20080710
- International Announcement: WO2009/007929 WO 20090115
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/544 ; H01L21/66 ; H01L23/00
Abstract:
Integrated circuits (1) on a wafer comprise a wafer substrate (2) and a plurality of integrated circuits (Ia, Ib, Ic) formed on the wafer substrate (2). Each integrated circuit (Ia, Ib, Ic) comprises an electric circuit (24) and some of the integrated circuits (Ib, Ic) comprise, in addition to their electric circuits (24), process control modules (3) as integral parts. The process control modules (3) are employed during dicing and pick-and-place to align the dicing/pick-and-place devices.
Public/Granted literature
- US20100140748A1 INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGRATED CIRCUITS Public/Granted day:2010-06-10
Information query
IPC分类:
