Invention Grant
- Patent Title: Fuse package and light emitting device module using the same
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Application No.: US14971183Application Date: 2015-12-16
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Publication No.: US09620490B2Publication Date: 2017-04-11
- Inventor: Seung Hwan Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0194690 20141231
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16 ; H01L23/10 ; H01L23/525 ; H01L23/62 ; H01L33/62
Abstract:
A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a portion of the first lead frame and at least a portion of the second lead frame, a wire fuse mounted on the first lead frame and the second lead frame, and configured to electrically connect the two lead frames, and an encapsulator configured to cover the wire fuse.
Public/Granted literature
- US20160190074A1 FUSE PACKAGE AND LIGHT EMITTING DEVICE MODULE USING THE SAME Public/Granted day:2016-06-30
Information query
IPC分类:
