Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
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Application No.: US15119420Application Date: 2015-02-27
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Publication No.: US09620499B2Publication Date: 2017-04-11
- Inventor: Yasuhiro Hirabayashi , Satoru Machida , Yusuke Yamashita
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: JP2014-092438 20140428
- International Application: PCT/JP2015/055954 WO 20150227
- International Announcement: WO2015/166703 WO 20151105
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L27/06 ; H01L29/868 ; H01L29/10 ; H01L21/265 ; H01L29/04 ; H01L29/32 ; H01L29/66 ; H01L29/36

Abstract:
A semiconductor device for restraining snapback is provided. The semiconductor device includes IGBT and diode regions. In a view of n-type impurity concentration distribution along a direction from a front surface to a rear surface, a local minimum value of an n-type impurity concentration is located at a border between cathode and buffer regions. A local maximum value of n-type impurity concentration is located in the buffer region. At least one of the buffer and cathode regions includes a crystal defect region having crystal defects in a higher concentration than a region therearound. A peak of a crystal defect concentration in a view of crystal defect concentration distribution along the direction from the front surface to the rear surface is located in a region on the rear surface side with respect to a specific position having the n-type impurity concentration which is a half of the local maximum value.
Public/Granted literature
- US20170069625A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2017-03-09
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