Invention Grant
- Patent Title: Semiconductor device with different fin sets
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Application No.: US15073100Application Date: 2016-03-17
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Publication No.: US09620505B2Publication Date: 2017-04-11
- Inventor: Qing Liu , Xiuyu Cai , Ruilong Xie , Chun-chen Yeh , Kejia Wang , Daniel Chanemougame
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION , STMICROELECTRONICS, INC , GLOBALFOUNDRIES INC.
- Applicant Address: US NY Armonk US TX Coppell KY Grand Cayman
- Assignee: International Business Machines Corporation,STMicroelectronics, Inc.,GlobalFoundries Inc.
- Current Assignee: International Business Machines Corporation,STMicroelectronics, Inc.,GlobalFoundries Inc.
- Current Assignee Address: US NY Armonk US TX Coppell KY Grand Cayman
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L27/088 ; H01L27/12 ; H01L29/66 ; H01L21/84 ; H01L29/06 ; H01L29/161

Abstract:
A semiconductor device which includes: a substrate; a first set of fins above the substrate of a first semiconductor material; a second set of fins above the substrate and of a second semiconductor material different than the first semiconductor material; and an isolation region positioned between the first and second sets of fins, the isolation region having a nitride layer. The isolation region may be an isolation pillar or an isolation trench.
Public/Granted literature
- US20160197072A1 SEMICONDUCTOR DEVICE WITH DIFFERENT FIN SETS Public/Granted day:2016-07-07
Information query
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