There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.