Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.