• Patent Title: Integration of millimeter wave antennas on microelectronic substrates
  • Application No.: US13996827
    Application Date: 2012-03-26
  • Publication No.: US09620847B2
    Publication Date: 2017-04-11
  • Inventor: Telesphor Kamgaing
  • Applicant: Telesphor Kamgaing
  • Applicant Address: US CA Santa Clara
  • Assignee: Intel Corporation
  • Current Assignee: Intel Corporation
  • Current Assignee Address: US CA Santa Clara
  • Agency: Winkle, PLLC
  • International Application: PCT/US2012/030634 WO 20120326
  • International Announcement: WO2013/147744 WO 20131003
  • Main IPC: H01Q1/22
  • IPC: H01Q1/22 H01Q21/00
Integration of millimeter wave antennas on microelectronic substrates
Abstract:
A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.
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