Invention Grant
- Patent Title: Integration of millimeter wave antennas on microelectronic substrates
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Application No.: US13996827Application Date: 2012-03-26
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Publication No.: US09620847B2Publication Date: 2017-04-11
- Inventor: Telesphor Kamgaing
- Applicant: Telesphor Kamgaing
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- International Application: PCT/US2012/030634 WO 20120326
- International Announcement: WO2013/147744 WO 20131003
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q21/00

Abstract:
A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.
Public/Granted literature
- US20140191905A1 INTEGRATION OF MILLIMETER WAVE ANTENNAS ON MICROELECTRONIC SUBSTRATES Public/Granted day:2014-07-10
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