Invention Grant
- Patent Title: Electronic high frequency device and manufacturing method
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Application No.: US14655134Application Date: 2013-01-09
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Publication No.: US09620854B2Publication Date: 2017-04-11
- Inventor: Ralf Reuter
- Applicant: Ralf Reuter
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- International Application: PCT/IB2013/050192 WO 20130109
- International Announcement: WO2014/108744 WO 20140717
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q13/00 ; H05K3/00 ; G01S13/02 ; G01S7/03 ; H01L23/66 ; H01L25/065 ; H01L23/552

Abstract:
An electronic device includes a wiring board having one or more layers, an integrated circuit arranged on the wiring board, an antenna, and a signal path. The integrated circuit generates a high frequency signal and feeds it to the signal path. The signal path conveys the high frequency signal to the antenna. The antenna emits the high frequency signal into an environment of the electronic device. Alternatively or in addition, the antenna receives the high frequency signal from the environment and feeds it to the signal path. The signal path conveys the high frequency signal to the integrated circuit. The integrated circuit processes the high frequency signal. The signal path includes a wave guide that traverses one or more of the layers of the wiring board.
Public/Granted literature
- US20150325908A1 ELECTRONIC HIGH FREQUENCY DEVICE AND MANUFACTURING METHOD Public/Granted day:2015-11-12
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