Invention Grant
- Patent Title: Process for producing shield layer-cut electric wire
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Application No.: US14297028Application Date: 2014-06-05
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Publication No.: US09620919B2Publication Date: 2017-04-11
- Inventor: Kanji Ishigure
- Applicant: Asahi Seiki Co., Ltd.
- Applicant Address: JP Gifu-shi
- Assignee: Asahi Seiki Co., Ltd.
- Current Assignee: Asahi Seiki Co., Ltd.
- Current Assignee Address: JP Gifu-shi
- Agency: Shumaker, Loop & Kendrick, LLP
- Main IPC: H01B13/20
- IPC: H01B13/20 ; H01R43/28 ; H02G1/12
Abstract:
A simplified process for producing a shield layer-cut electric wire that does not damage an insulating layer and a core wire and when cutting a shield layer.
Public/Granted literature
- US20150357094A1 PROCESS AND APPARATUS FOR PRODUCING SHIELD LAYER-CUT ELECTRIC WIRE Public/Granted day:2015-12-10
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