Invention Grant
- Patent Title: Modular system having expandable form factor
-
Application No.: US14192757Application Date: 2014-02-27
-
Publication No.: US09620976B2Publication Date: 2017-04-11
- Inventor: John Medica , Leonard Tsai , Shikuan Chen
- Applicant: COMPAL ELECTRONICS, INC.
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: Liu & Liu
- Main IPC: H02J7/00
- IPC: H02J7/00 ; G06F1/16

Abstract:
A modular system of devices, in which a (master) device can be combined with one or more of other (slave) devices to transform to functional electronic devices having expanded functionalities and features in different form factors and/or platforms. The master device is docked to the slave device via a data/electrical interface, to transform the master device to the larger form factor of the slave device, with the master device maintaining control of the slave device, substantially based on the operating system installed in the master device, with access to the data, application programs, functionalities and features embodied in the master device. An intermediate removable physical interface adaptor (or docking adaptor) is provided to facilitate docking compatibility of the master device to the slave device. An enhanced charging and power management scheme is provided to optimize power management for the master device and the slave device.
Public/Granted literature
- US20140312827A1 MODULAR SYSTEM HAVING EXPANDABLE FORM FACTOR Public/Granted day:2014-10-23
Information query