A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state.