Invention Grant
- Patent Title: Housing-side separating layer for the stress decoupling of potted electronics
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Application No.: US14009414Application Date: 2012-04-04
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Publication No.: US09622372B2Publication Date: 2017-04-11
- Inventor: Jakob Schillinger , Dietmar Huber , Dirk Theobald
- Applicant: Jakob Schillinger , Dietmar Huber , Dirk Theobald
- Applicant Address: DE Frankfurt
- Assignee: Continental Teves AG & Co. oHG
- Current Assignee: Continental Teves AG & Co. oHG
- Current Assignee Address: DE Frankfurt
- Agency: RatnerPrestia
- Priority: DE102011007012 20110407; DE102011086048 20111109
- International Application: PCT/EP2012/056139 WO 20120404
- International Announcement: WO2012/136692 WO 20121011
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H05K7/14 ; H05K5/00
Abstract:
The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.
Public/Granted literature
- US20140027172A1 HOUSING-SIDE SEPARATING LAYER FOR THE STRESS DECOUPLING OF POTTED ELECTRONICS Public/Granted day:2014-01-30
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