Invention Grant
- Patent Title: Heat-sink device intended for at least one electronic component and corresponding method
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Application No.: US13877752Application Date: 2011-09-27
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Publication No.: US09622382B2Publication Date: 2017-04-11
- Inventor: Adrien Gasse , Pascal Revirand
- Applicant: Adrien Gasse , Pascal Revirand
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Clark & Brody
- Priority: FR1003931 20101005
- International Application: PCT/IB2011/054243 WO 20110927
- International Announcement: WO2012/046161 WO 20120412
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/36 ; H01L21/48 ; H01L23/367 ; H01L23/373 ; H05K3/30 ; F21V29/87 ; F21V29/71 ; F21Y115/10
Abstract:
A heat-sink device intended for at least one electronic component (12), includes: a heat-sink; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins (10), and the thermal-coupling (13) is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate (11) and the fins (10).
Public/Granted literature
- US20130322019A1 HEAT-SINK DEVICE INTENDED FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD Public/Granted day:2013-12-05
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