A radiation-curable laminating adhesive is provided which contains a) at least one urethane (meth)acrylate oligomer and b) at least one additional (meth)acrylate-functionalized component selected from the group consisting of carboxylic acid-functionalized ester-containing (meth)acrylate monomers and polybutadiene poly(meth)acrylates. The adhesive may also contain other components such as (meth)acrylic polyol (meth)acrylates. Flexible packaging laminates may be obtained by using the aforedescribed adhesive to adhere thin polymeric and/or metallic films together, the adhesive being exposed to an amount of radiation effective to cure the adhesive.