Invention Grant
- Patent Title: Robust interface bonding with B-staged thermoplastic polyimide adhesive
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Application No.: US13972509Application Date: 2013-08-21
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Publication No.: US09624412B2Publication Date: 2017-04-18
- Inventor: James B. Fraivillig
- Applicant: James B. Fraivillig
- Applicant Address: US MA Boston
- Assignee: FRAIVILLIG TECHNOLOGIES COMPANY
- Current Assignee: FRAIVILLIG TECHNOLOGIES COMPANY
- Current Assignee Address: US MA Boston
- Agent John M Brandt
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08L51/00 ; C08L77/00 ; C08G73/10 ; C08K5/34 ; C08K5/20 ; B05D1/18 ; C09J179/08 ; B05D1/26 ; B05D1/28 ; B32B27/28 ; C09J7/02
Abstract:
Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.
Public/Granted literature
- US20150057396A1 Robust Interface Bonding with B-staged Thermoplastic Polyimide Adhesive Public/Granted day:2015-02-26
Information query
