Invention Grant
- Patent Title: Anodization architecture for electro-plate adhesion
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Application No.: US14463001Application Date: 2014-08-19
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Publication No.: US09624593B2Publication Date: 2017-04-18
- Inventor: Jennifer Y. Sun , Biraja P. Kanungo
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: C23C28/00
- IPC: C23C28/00 ; C25D5/00 ; C25D5/48 ; C25D5/50 ; C25D11/12 ; C25D11/20 ; C25D5/44 ; C25D11/04 ; C25D11/02 ; C25D11/08
Abstract:
To manufacture a chamber component for a processing chamber a first anodization layer is formed on a metallic article with impurities, the first anodization layer having a thickness greater than about 100 nm, and an aluminum coating is formed on the first anodization layer, the aluminum coating being substantially free from impurities. A second anodization layer can be formed on the aluminum coating.
Public/Granted literature
- US20150064450A1 ANODIZATION ARCHITECTURE FOR ELECTRO-PLATE ADHESION Public/Granted day:2015-03-05
Information query
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