Invention Grant
- Patent Title: Interlace lifting mechanism
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Application No.: US14477573Application Date: 2014-09-04
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Publication No.: US09625048B2Publication Date: 2017-04-18
- Inventor: Kim Ngoc Vu
- Applicant: HORIBA STEC CO., LTD.
- Applicant Address: JP Kyoto-shi
- Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee Address: JP Kyoto-shi
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Main IPC: F16K31/02
- IPC: F16K31/02 ; F16K31/00 ; H02N2/04

Abstract:
A mechanism for coupling motion of a piezoelectric actuator in axisymmetric devices like modulating proportional valves uses actuator extension motion to cause translation away from a mechanism mounting plane and thereby enables lifting open of a valve element instead of the usual pushing closed of the valve element. The mechanism does not contain any gears nor leadscrew threads, and in usual practice is constantly loaded, so apparent change of direction is achieved without mechanical backlash introducing hysteresis. The mechanism surrounds a piezoelectric stack actuator by contacting opposite ends of the piezoelectric stack, whereby extension motion lengthening the actuator causes a lifting portion of the mechanism to translate toward the bulk of the actuator while the proximally adjacent mounting portion of the mechanism remains at a fixed location.
Public/Granted literature
- US20150059877A1 INTERLACE LIFTING MECHANISM Public/Granted day:2015-03-05
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